SC-1 Series ALD
Expansion of the CE Lab
New Thin Film Coating Technologies
We are happy to announce that we will significantly expand our thin film coating technologies for our students in the Creative Engineering Lab with a second ALD deposition line and a new pulsed DC Sputtering system!
The SC-1 from Swiss Cluster represents the next generation in materials fabrication, being the first to combine Atomic Layer Deposition (ALD) and Physical Vapour Deposition (PVD) in a compact and modular system.
This patent-pending innovative vertical chamber design eliminates the need for transfer arms and antechambers, avoiding the issues that make traditional cluster equipment large and expensive to acquire and operate.
The chambers are separated by a gate valve that remains closed during ALD and opens for the PVD process without needing to move the substrate or break the vacuum.
The SC-1 can fabricate any number of multi-nanolayers from multiple material systems using the PVD and ALD/CVD materials library. Both the hardware and software are fully modular, making it easy to configure, maintain, and upgrade.
These features, combined with our flexible machine control and recipe creation software suite, give you complete control over the system and its automation.
| Technical | Specifications |
|---|---|
| Substrate Holders Sizes and Temperatures | 4 inch wafers Temperature Gradient Stage (30°C to
450°C, and 400°C homogenous) High Temperature |
| Loading | Loading from the top via interchangeable
substrate holders Custom-made frame holders for 3D parts, Cleanroom and Glovebox compatible |
| ALD Precursors | Up to 500°C |
| Precursors | Up to 8 gas sources with 6 individual inlets
Ozone option Microwave plasma sources for PE-ALD |
| PVD Sputtering Sources | 2 inch targets Different power supplies: DC, RF, HiPIMS |
| Standard Materials | Single layers and multinanolayers of: Al₂O₃, TiO₂, Cu, Al, Ti, Mg, and more... |
SC-1 Series ALD
